Part Number Hot Search : 
2SK3387 0F88M M35054 SCX15DN 200GB 2D120 AN4276 ENA0412A
Product Description
Full Text Search
 

To Download SI5504BDC-T1-E3 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  vishay siliconix si5504bdc document number: 74483 s10-0547-rev. b, 08-mar-10 www.vishay.com 1 n- and p-channel 30 v (d-s) mosfet product summary v ds (v) r ds(on) ( )i d (a) q g (typ) n-channel 30 0.065 at v gs = 10 v 4 a 2 nc 0.100 at v gs = 4.5 v 4 a p-channel - 30 0.140 at v gs = - 10 v - 3.7 2.2 nc 0.235 at v gs = - 4.5 v - 2.8 marking code ef xxx lot tracea b ility and date code part # code n -channel mosfet g 1 d 1 s 1 s 2 g 2 d 2 p-channel mosfet bottom v ie w 1206-8 chipfet s 1 g 1 s 2 g 2 d 1 d 1 d 2 d 2 1 dual orderin g information: SI5504BDC-T1-E3 (lead (p b )-free) si5504bdc-t1-ge3 (lead (p b )-free and halogen-free) notes: a. package limited. b. surface mounted on 1" x 1" fr4 board. c. t = 5 s. d. see reliability manual for profile. the chipfet is a leadless package. the end of the lead terminal is exposed copper (not pl ated) as a result of the singulation process in manufacturing. a solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequade bottom side solder interconnection. e. rework conditions: manual solderi ng with a soldering iron is not recommended for leadless components. f. maximum under steady state conditions is 120 c/w. absolute maximum ratings t a = 25 c, unless otherwise noted parameter symbol n-channel p-channel unit drain-source voltage v ds 30 - 30 v gate-source voltage v gs 20 continuous drain current (t j = 150 c) t c = 25 c i d 4 a - 3.7 a t c = 85 c 3.8 - 2.7 t a = 25 c 3.7 b, c - 2.5 b, c t a = 85 c 2.6 b, c - 1.8 b, c pulsed drain current i dm 10 - 10 source drain current diode current t c = 25 c i s 2.5 - 2.5 t a = 25 c 1.3 b, c - 1.3 b, c maximum power dissipation t c = 25 c p d 3.12 3.1 w t c = 85 c 22 t a = 25 c 1.5 b, c 1.5 b, c t a = 85 c 0.8 b, c 0.8 b, c operating junction and storage temperature range t j , t stg - 55 to 150 c soldering recommendations (peak temperature) d, e 260 thermal resistance ratings parameter symbol n-channel p-channel unit typ. max. typ. max. maximum junction-to-ambient b, f t 5 s r thja 70 85 70 85 c/w maximum junction-to-foot (drain) steady state r thjf 33 40 33 40 features ? halogen-free accord ing to iec 61249-2-21 definition ? trenchfet ? power mosfets ? compliant to rohs directive 2002/95/ec applications ? dc/dc for portable applications ? load switch
www.vishay.com 2 document number: 74483 s10-0547-rev. b, 08-mar-10 vishay siliconix si5504bdc notes: a. guaranteed by design, not s ubject to production testing. b. pulse test; pulse width 300 s, duty cycle 2 %. specifications t j = 25 c, unless otherwise noted parameter symbol test conditions min. typ. max. unit static drain-source breakdown voltage v ds v gs = 0 v, i d = 250 a n-ch 30 v v gs = 0 v, i d = - 250 a p-ch - 30 v ds temperature coefficient v ds /t j i d = 250 a n-ch 27 mv/c i d = - 250 a p-ch - 30 v gs(th) temperature coefficient v gs(th) /t j i d = 250 a n-ch - 5 i d = - 250 a p-ch 3.5 gate threshold voltage v gs(th) v ds = v gs , i d = 250 a n-ch 1.5 3 v v ds = v gs , i d = - 250 a p-ch - 1.5 - 3 gate-body leakage i gss v ds = 0 v, v gs = 20 v n-ch 100 na p-ch - 100 zero gate voltage drain current i dss v ds = 30 v, v gs = 0 v n-ch 1 a v ds = - 30 v, v gs = 0 v p-ch - 1 v ds = 30 v, v gs = 0 v, t j = 85 c n-ch 5 v ds = - 30 v, v gs = 0 v, t j = 85 c p-ch - 5 on-state drain current b i d(on) v ds 5 v, v gs = 10 v n-ch 10 a v ds - 5 v, v gs = - 10 v p-ch - 10 drain-source on-state resistance b r ds(on) v gs = 10 v, i d = 3.1 a n-ch 0.053 0.065 v gs = - 10 v, i d = - 2.1 a p-ch 0.112 0.140 v gs = 4.5 v, i d = 1 a n-ch 0.081 0.100 v gs = - 4.5 v, i d = - 0.43 a p-ch 0.188 0.235 forward transconductance b g fs v ds = 15 v, i d = 3.1 a n-ch 5 s v ds = - 15 v, i d = - 2.1 a p-ch 3.5 dynamic a input capacitance c iss n-channel v ds = 15 v, v gs = 0 v, f = 1 mhz p-channel v ds = - 15 v, v gs = 0 v, f = 1 mhz n-ch 220 pf p-ch 170 output capacitance c oss n-ch 50 p-ch 50 reverse transfer capacitance c rss n-ch 25 p-ch 31 total gate charge q g v ds = 15 v, v gs = 10 v, i d = 3.6 a n-ch 4.5 7 nc v ds = - 15 v, v gs = - 10 v, i d = - 2.5 a p-ch 4.5 7 n-channel v ds = 15 v, v gs = 4.5 v, i d = 3.6 a p-channel v ds = - 15 v, v gs = - 4.5 v, i d = - 2.5 a n-ch 2 3 p-ch 2.2 3.5 gate-source charge q gs n-ch 0.7 p-ch 0.7 gate-drain charge q gd n-ch 0.7 p-ch 1 gate resistance r g f = 1 mhz n-ch 3 p-ch 13
document number: 74483 s10-0547-rev. b, 08-mar-10 www.vishay.com 3 vishay siliconix si5504bdc notes: a. guaranteed by design, not subject to production testing. b. pulse test; pulse width 300 s, duty cycle 2 %. stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indi cated in the operational sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended per iods may affect device reliability. specifications t j = 25 c, unless otherwise noted parameter symbol test conditions min. typ. max. unit dynamic a tu r n - o n d e l ay t i m e t d(on) n-channel v dd = 15 v, r l = 5.8 i d ? 2.6 a, v gen = 4.5 v, r g = 1 p-channel v dd = - 15 v, r l = 7.5 i d ? - 2 a, v gen = - 4.5 v, r g = 1 n-ch 15 25 ns p-ch 30 45 rise time t r n-ch 80 120 p-ch 60 90 turn-off delay time t d(off) n-ch 12 20 p-ch 10 15 fall time t f n-ch 25 40 p-ch 10 15 tu r n - o n d e l ay t i m e t d(on) n-channel v dd = 15 v, r l = 5.8 i d ? 2.6 a, v gen = 10 v, r g = 1 p-channel v dd = - 15 v, r l = 7.5 i d ? - 2 a, v gen = - 10 v, r g = 1 n-ch 4 8 p-ch 4 8 rise time t r n-ch 12 20 p-ch 10 15 turn-off delay time t d(off) n-ch 10 15 p-ch 10 15 fall time t f n-ch 5 10 p-ch 5 10 drain-source body diode characteristics continuous source-drain diode current i s t c = 25 c n-ch 2.5 a p-ch - 2.5 pulse diode forward current a i sm n-ch 10 p-ch - 10 body diode voltage v sd i s = 2.6 a, v gs = 0 v n-ch 0.8 1.2 v i s = - 2 a, v gs = 0 v p-ch - 0.8 - 1.2 body diode reverse recovery time t rr n-channel i f = 2.6 a, di/dt = 100 a/s, t j = 25 c p-channel i f = - 2 a, di/dt = - 100 a/s, t j = 25 c n-ch 30 50 ns p-ch 20 40 body diode reverse recovery charge q rr n-ch 20 40 nc p-ch 10 20 reverse recovery fall time t a n-ch 23 ns p-ch 13 reverse recovery rise time t b n-ch 7 p-ch 7
www.vishay.com 4 document number: 74483 s10-0547-rev. b, 08-mar-10 vishay siliconix si5504bdc n-channel typical characteristics 25 c, unless otherwise noted output characteristics on-resistance vs. drain current gate charge 0 4 8 12 16 20 0.0 0.5 1.0 1.5 2.0 2.5 v gs = 10 v thr u 6 v 3 v v ds - drain-to-so u rce v oltage ( v ) - drain c u rrent (a) i d 4 v 5 v - on-resistance ( ) r ds(on) 0.00 0.04 0.0 8 0.12 0.16 0.20 0 5 10 15 20 i d - drain c u rrent (a) v gs = 4.5 v v gs = 10 v 0 2 4 6 8 10 012345 v ds = 15 v , i d - gate-to-so u rce v oltage ( v ) q g - total gate charge (nc) v gs v ds = 24 v , i d = 3.6 a = 3.6 a transfer characteristics capacitance on-resistance vs. junction temperature 0 1 2 3 4 5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 t c = 125 c t c = 25 c v gs - gate-to-so u rce v oltage ( v ) - drain c u rrent (a) i d t c = - 55 c 0 50 100 150 200 250 300 0 5 10 15 20 25 30 v ds - drain-to-so u rce v oltage ( v ) c rss c oss c iss c - capacitance (pf) 0.6 0. 8 1.0 1.2 1.4 1.6 1. 8 - 50 - 25 0 25 50 75 100 125 150 v gs = 10 v , 4.5 v i d = 3.1 a t j - j u nction temperat u re (c) ( n ormalized) - on-resistance r ds(on)
document number: 74483 s10-0547-rev. b, 08-mar-10 www.vishay.com 5 vishay siliconix si5504bdc n-channel typical characteristics 25 c, unless otherwise noted source-drain diode forward voltage threshold voltage 0.0 0.2 0.4 0.6 0. 8 1.0 1.2 t j = 150 c t j = 25 c 1 v sd ) v ( e g a t l o v n i a r d - o t - e c r u o s - - so u rce c u rrent (a) i s 10 1.2 1.4 1.6 1. 8 2.0 2.2 2.4 - 50 - 25 0 25 50 75 100 125 150 i d = 250 a ( v ) v gs(th) t j - temperat u re (c) on-resistance vs. gate-to-source voltage single pulse power 0.04 0.0 8 0.12 0.16 0.20 0246 8 10 i d = 3.1 a - on-resistance ( ) r ds(on) v gs - gate-to-so u rce v oltage ( v ) 125 c 25 c 0.001 0 1 50 10 30 10 0.01 po w er ( w ) time (s) 20 40 0.1 100 1000 0.0001 safe operating area, junction-to-ambient - drain c u rrent (a) i d 1 0.01 100 1 0.1 0.01 0.1 10 t a = 25 c single p u lse 10 ms 1 s, 10 s dc 100 s 10 1 ms v ds - drain-to-so u rce v oltage ( v ) * v gs minim u m v gs at w hich r ds(on) is specified limited b y r * ds(on) 100 ms b v dss limited
www.vishay.com 6 document number: 74483 s10-0547-rev. b, 08-mar-10 vishay siliconix si5504bdc n-channel typical characteristics 25 c, unless otherwise noted * the power dissipation p d is based on t j(max) = 150 c, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. it is used to determine the current rating, when this rating falls below the package limit. current derating* 0 1 2 3 4 5 6 0 25 50 75 100 125 150 i d - drain c u rrent (a) t c - case temperat u re (c) package limited power derating 0 1 2 3 4 25 50 75 100 125 150 t c - case temperat u re (c) po w er dissipation ( w )
document number: 74483 s10-0547-rev. b, 08-mar-10 www.vishay.com 7 vishay siliconix si5504bdc n-channel typical characteristics 25 c, unless otherwise noted normalized thermal transient impedance, junction-to-ambient s qu are w a v e p u lse d u ration (s) n ormalized effecti v e transient thermal impedance 2 1 0.1 0.01 10 -3 10 -2 0 0 6 0 1 1 10 -1 10 -4 d u ty cycle = 0.5 0.2 0.1 0.05 0.02 single p u lse 100 1. d u ty cycle, d = 2. per unit base = r thja = 1 00 c/ w 3. t jm - t a = p dm z thja (t) t 1 t 2 t 1 t 2 n otes: 4. s u rface mo u nted p dm normalized thermal transient impedance, junction-to-foot 10 -3 10 -2 0 1 1 10 -1 10 -4 2 1 0.1 0.01 0.2 0.1 0.05 0.02 single p u lse d u ty cycle = 0.5 s qu are w a v e p u lse d u ration (s) n ormalized effecti v e transient thermal impedance
www.vishay.com 8 document number: 74483 s10-0547-rev. b, 08-mar-10 vishay siliconix si5504bdc p-channel typical characteristics 25 c, unless otherwise noted output characteristics on-resistance vs. drain current gate charge 0 2 4 6 8 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 v gs = 10 v thr u 5 v v ds - drain-to-so u rce v oltage ( v ) - drain c u rrent (a) i d 3 v 4 v - on-resistance ( ) r ds(on) 0.0 0.1 0.2 0.3 0.4 0246 8 10 i d - drain c u rrent (a) v gs = 10 v v gs = 4.5 v 0 2 4 6 8 10 012345 i d = 2.5 a - gate-to-so u rce v oltage ( v ) q g - total gate charge (nc) v gs v ds = 15 v v ds = 24 v transfer characteristics capacitance on-resistance vs. junction temperature 0 1 2 3 4 5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 t c = 125 c 25 c v gs - gate-to-so u rce v oltage ( v ) - drain c u rrent (a) i d - 55 c 0 50 100 150 200 250 0 5 10 15 20 25 30 v ds - drain-to-so u rce v oltage ( v ) c - capacitance (pf) c oss c iss c rss 0.6 0. 8 1.0 1.2 1.4 1.6 1. 8 - 50 - 25 0 25 50 75 100 125 150 v gs = 4.5 v , 10 v i d = 2.2 a t j - j u nction temperat u re (c) r ds(on) - on-resistance ( n ormalized)
document number: 74483 s10-0547-rev. b, 08-mar-10 www.vishay.com 9 vishay siliconix si5504bdc p-channel typical characteristics 25 c, unless otherwise noted source-drain diode forward voltage threshold voltage 0.0 0.2 0.4 0.6 0. 8 1.0 1.2 t j = 150 c t j = 25 c 10 1 v sd ) v ( e g a t l o v n i a r d - o t - e c r u o s - - so u rce c u rrent (a) i s 1.4 1.5 1.6 1.7 1. 8 1.9 2.0 2.1 2.2 - 50 - 25 0 25 50 75 100 125 150 i d = 250 a ( v ) v gs(th) t j - temperat u re (c) on-resistance vs. gate-to-source voltage single pulse power 0.0 0.1 0.2 0.3 0.4 246 8 10 i d = 2.2 a - on-resistance ( ) r ds(on) v gs - gate-to-so u rce v oltage ( v ) 125 c 25 c 0.001 0 1 50 10 30 10 0.01 po w er ( w ) time (s) 20 40 0.1 100 1000 0.0001 safe operating area, junction-to-ambient 0.01 v ds - drain-to-so u rce v oltage ( v ) * v gs minim u m v gs at w hich r ds(on) is specified - drain c u rrent (a) i d 10 0.1 0.1 1 10 limited b y r * ds(on) 1 t a = 25 c single p u lse 100 ms 1 s, 10 s dc 100 s 100 10 ms 0.01 1 ms b v dss limited
www.vishay.com 10 document number: 74483 s10-0547-rev. b, 08-mar-10 vishay siliconix si5504bdc p-channel typical characteristics 25 c, unless otherwise noted * the power dissipation p d is based on t j(max) = 150 c, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. it is used to determine the current rating, when this rating falls below the package limit. current derating* 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 25 50 75 100 125 150 t c - case temperat u re (c) i d - drain c u rrent (a) power derating 0 1 2 3 4 25 50 75 100 125 150 t c - case temperat u re (c) po w er dissipation ( w )
document number: 74483 s10-0547-rev. b, 08-mar-10 www.vishay.com 11 vishay siliconix si5504bdc p-channel typical characteristics 25 c, unless otherwise noted vishay siliconix maintains worldwide manufacturing capability. pr oducts may be manufactured at one of several qualified locatio ns. reliability data for silicon technology and package reliability represent a composite of all qualified locations. for related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?74483 . normalized thermal transient impedance, junction-to-ambient s qu are w a v e p u lse d u ration (s) n ormalized effecti v e transient thermal impedance 2 1 0.1 0.01 10 -3 10 -2 0 0 6 0 1 1 10 -1 10 -4 d u ty cycle = 0.5 0.2 0.1 0.05 0.02 single p u lse 100 1. d u ty cycle, d = 2. per unit base = r thja = 100 c/ w 3. t jm - t a = p dm z thja (t) t 1 t 2 t 1 t 2 n otes: 4. s u rface mo u nted p dm normalized thermal transient impedance, junction-to-foot 10 -3 10 -2 0 1 1 10 -1 10 -4 2 1 0.1 0.01 0.2 0.1 0.05 0.02 single p u lse d u ty cycle = 0.5 s qu are w a v e p u lse d u ration (s) n ormalized effecti v e transient thermal impedance
document number: 91000 www.vishay.com revision: 18-jul-08 1 disclaimer legal disclaimer notice vishay all product specifications and data are subject to change without notice. vishay intertechnology, inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, ?vishay?), disclaim any and all liability fo r any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. vishay disclaims any and all li ability arising out of the use or application of any product describ ed herein or of any information provided herein to the maximum extent permit ted by law. the product specifications do not expand or otherwise modify vishay?s terms and conditions of purcha se, including but not limited to the warranty expressed therein, which apply to these products. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of vishay. the products shown herein are not designed for use in medi cal, life-saving, or life-sustaining applications unless otherwise expressly indicated. customers using or selling vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify vishay for any damages arising or resulting from such use or sale. please contact authorized vishay personnel to obtain written terms and conditions regarding products designed for such applications. product names and markings noted herein may be trademarks of their respective owners.


▲Up To Search▲   

 
Price & Availability of SI5504BDC-T1-E3

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X